Trends of On-Chip Interconnects in Deep Sub-Micron VLSI
نویسندگان
چکیده
This paper discusses propagation delay error, transient response, and power consumption distribution due to inductive effects in optimal buffered on-chip interconnects. Inductive effect is said to be important to consider in deep submicron (DSM) VLSI design. However, study shows that the effect decreases and can be neglected in next technology nodes for such conditions. key words: on-chip interconnects, deep sub-micron, inductive effect, signal integrity
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ورودعنوان ژورنال:
- IEICE Transactions
دوره 89-C شماره
صفحات -
تاریخ انتشار 2006